Nano Dimension files patent for oxidation-resistant copper nanoparticles for 3D printed electronics

Nano Dimension, an Israeli 3D printed electronics specialist, has announced that its Nano Dimension Technologies subsidiary has successfully developed copper nanoparticles that are not only oxidation-resistant, but can be fused into a conductive line after the sintering process. Nano Dimension Technologies has filed a patent application for its copper particles with the U.S. Patent and Trademark Office.

from 3ders.org - http://www.3ders.org