High-Profile Collaboration in 3D Printing Enhances Market Access, Development: CES 2018 Interview with Techniplas Open Innovation Program Partners

CES 2018 drew the tech crowds to Las Vegas last week, including many familiar faces in 3D printing. Highlighted among these in the 3D Printing Marketplace of the North Hall of the Las Vegas...

View the entire article via our website.

from 3DPrint.com | The Voice of 3D Printing / Additive Manufacturing