Researchers from Michigan Technological University have developed an open-source parametric 3D printed slot die system for thin film semiconductor processing. By using the 3D printed system over a commercial one, users could make cost savings of over 17,000 per cent.
from 3ders.org - http://www.3ders.org
lunes, 15 de enero de 2018
9:46
MR: EDITOR
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